When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
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When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
Episode 100 – Automation Panel: Tariffs, Supply Chains, and What’s Next
Manufacturing Matters
47 minutes
6 months ago
Episode 100 – Automation Panel: Tariffs, Supply Chains, and What’s Next
“Whether its tariffs, COVID-19, the chip crisis, shipping issues, changes in EV direction, or beyond; every market disruption is a chance to adopt or adapt your strategies and methods of getting things done.” In this special panel discussion episode of the Manufacturing Matters podcast, Jeff Stello (Metaphase Technologies), Jason Covar (The Imaging Source), Gerd Walter (Creative Automation), and Stu Shepherd (this year’s Engelberger Award recipient; Shepherd Solutions, Inc., joined TECH B2B M...
Manufacturing Matters
When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
