When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
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When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
Episode 103 - Vikas Enti, CEO and Co-Founder of Reframe Systems
Manufacturing Matters
40 minutes
5 months ago
Episode 103 - Vikas Enti, CEO and Co-Founder of Reframe Systems
"We’re on a mission to build climate resilient homes for all…leveraging the latest robotics and automation technologies." Construction costs have doubled in the last decade, and we have a shortage of skilled workers to build them anyway. In addition, climate events are getting more severe, so how can we start designing products that are climate-friendly, more resilient to changing weather patterns, and significantly less expensive? That’s Reframe Systems in a nutshell, explained Vikas ...
Manufacturing Matters
When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
