When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
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When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
Episode 106 – Kence Anderson, founder and CEO of Composabl
Manufacturing Matters
39 minutes
4 months ago
Episode 106 – Kence Anderson, founder and CEO of Composabl
Artificial intelligence has been around for many years, but the face of AI is continually changing. Today, by applying well-engineered AI to manufacturing toolsets, we can get closed-loop control and automation that has more humanlike characteristics than ever before. For this episode of Manufacturing Matters, TECH B2B Marketing’s Winn Hardin and Aaron Hand caught up with Kence Anderson, founder and CEO of Composabl, at Automate 2025. Anderson puts Composabl’s multi-agent AI systems into pers...
Manufacturing Matters
When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
