When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
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When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
Episode 108 – Chris Matthieu, and Fred Angelopoulos of RealSense
Manufacturing Matters
30 minutes
4 months ago
Episode 108 – Chris Matthieu, and Fred Angelopoulos of RealSense
"With AI technology, anyone can be a programmer. If you have an idea, whether you can code or not, AI can write the RealSense code, and you can deploy an AI-enabled 3D camera for less than $100." Walk any robotics show floor and chances are you will see RealSense cameras in many of the robots and autonomous mobile robots (AMRs) on display, which made it surprising years ago when erroneous reports said that Intel was winding down the RealSense division. Things have changed drastically since th...
Manufacturing Matters
When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
