When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
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When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
Episode 109 – Craig Coyle, Founder and CEO of Operation Lead
Manufacturing Matters
26 minutes
3 months ago
Episode 109 – Craig Coyle, Founder and CEO of Operation Lead
"How can lessons learned as an Apache pilot in the military translate into aerospace engineering and the general world of manufacturing?" Lead like a pilot means placing an importance on structure, guidance, and community, says Operation Lead’s Craig Coyle. A former Apache pilot, Coyle joined TECH B2B Marketing’s Jimmy Carroll on this episode of Manufacturing Matters to discuss this concept and its applicability to manufacturing today. The discussion covered workforce challenges, leadership ...
Manufacturing Matters
When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
