When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
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When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
Episode 111 - Anthony Jules, Founder and CEO of Robust AI
Manufacturing Matters
36 minutes
3 months ago
Episode 111 - Anthony Jules, Founder and CEO of Robust AI
"As much as we feel like the change is never ending right now, that's going to be the constant for the next couple of decades. We're going to have more options for how we increase productivity, how we collaborate with robots and each other, and how we build value. " Right now, we are at such an incredible moment in history in terms of AI and robotics, and we’re just at the beginning of this journey, suggests Anthony Jules, Founder and CEO of Robust AI. The hard part, he says, is going to be ...
Manufacturing Matters
When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
