When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
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When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
Episode 112 – Rajat Bhageria, Founder and CEO of Chef Robotics
Manufacturing Matters
37 minutes
2 months ago
Episode 112 – Rajat Bhageria, Founder and CEO of Chef Robotics
“While many applications within the food manufacturing space have been successfully automated, some gaps exist when it comes to high-mix automation, including the handling of prepared sandwiches, salads, and other meals. By augmenting robots with advanced AI, automation can be scaled to all parts of the food supply chain, starting with manufacturing.” In the automation of food manufacturing, certain challenges are inherent to the industry, particularly when it comes to handling a highly varia...
Manufacturing Matters
When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
