When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
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When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
Episode 113 - Darcy Bachert, CEO of Prolucid Technologies
Manufacturing Matters
39 minutes
2 months ago
Episode 113 - Darcy Bachert, CEO of Prolucid Technologies
"Businesses in manufacturing and beyond face significant challenges today, whether their reshoring operations, skill shortages, labor shortages, or political strain, but today’s automation technologies can help solve these problems." In this episode of the Manufacturing Matters podcast, Darcy Bachert, CEO of Prolucid Technologies and Chairperson of the A3 Board of Directors joins TECH B2B Marketing’s Winn Hardin and Jimmy Carroll to take a high-level look at some of the biggest challenges in...
Manufacturing Matters
When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
