When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
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When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
Episode 115 – Ted Larson, CEO and co-founder of OLogic
Manufacturing Matters
51 minutes
1 month ago
Episode 115 – Ted Larson, CEO and co-founder of OLogic
If you’re a first-time climber trying to tackle Mount Everest, the only way you’ll make it to the top and come back alive is if you’ve got a great set of Sherpas to carry your stuff and show you the way. That’s how Ted Larson, CEO and co-founder of OLogic, views his company’s role as it helps startup companies navigate their way from lab to volume production. Building a good working prototype in an academic setting can be a far cry from building tens of thousands of production-grade pro...
Manufacturing Matters
When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
