This week, we look back at the breakthroughs and challenges unveiled at SEMICON 2025 in Taipei, and preview the upcoming Taiwan Tech Summit in Silicon Valley—two events that showcase Taiwan’s central role in the global tech arena.


SEMICON 2025：AI and Advanced Packaging at the Forefront

The 2025 International Semiconductor Exhibition (SEMICON 2025) in Taipei celebrated its 30th anniversary with a record scale: 1,200 companies from 56 countries, 4,100 booths, and nearly 100,000 attendees. 

Highlights included AI, high-performance computing, and advanced packaging technologies such as 3D IC and chiplets, alongside themes like automotive semiconductors, robotics, sustainability, and cybersecurity. Industry leaders from TSMC, Google, Infineon, and NXP debated power and talent challenges while unveiling innovations like Google’s latest TPU and SK Hynix’s HBM4 memory.

Taiwan Tech Summit 2025 debuts in Santa Clara

Taiwan Tech Summit 2025 gathered over 3,500 professionals at the Santa Clara Convention Center, highlighting Taiwan’s ambition to evolve from a semiconductor hub into a global innovation leader. The event featured forums on AI, biotech, design, and cross-border entrepreneurship, alongside a Demo Day where startups with proven traction pitched for international investment.

The Summit underscored Taiwan’s determination to become not just a supplier of hardware but a partner in shaping the future of AI, biotech, and human-centered technology. It marked both a milestone and a call to action for Taiwan’s global innovation journey.