On this episode of The Data Center Frontier Show, Editor in Chief Matt Vincent sits down with Rob Campbell, President of Flex Communications, Enterprise & Cloud, and Chris Butler, President of Flex Power, to unpack Flex’s bold new integrated data center platform as unveiled at the 2025 OCP Global Summit. Flex says the AI era has broken traditional data center models, pushing power, cooling, and compute to the point where they can no longer be engineered separately. Their answer is a globally manufactured, pre-engineered platform that unifies these components into modular pods and skids, designed to cut deployment timelines by up to 30 percent and support gigawatt-scale AI campuses. Rob and Chris explain how Flex is blending JetCool’s chip-level liquid cooling with scalable rack-level CDUs; how higher-voltage DC architectures (400V today, 800V next) will reshape power delivery; and why Flex’s 110-site global manufacturing footprint gives it a unique advantage in speed and resilience. They also explore Flex’s lifecycle intelligence strategy, the company’s circular-economy approach to modular design, and their view of the “data center of 2030”—a landscape defined by converged power and IT, liquid cooling as default, and modular units capable of being deployed in 30–60 days. It’s a deep look at how one of the world’s largest manufacturers plans to redefine AI-scale infrastructure.