Remtec president, Brian Buyea, leads us through ceramic as a board substrate, including a discussion of the ideal applications, technical advantages, and a customer story or two. Remtec's 35 years of manufacturing experience, along with a staff of qualified engineers, creates a deeply collaborative relationship with their customers.
In this episode, John Johnson wraps up this series with some frequently asked engineering questions about UHDI adoption and gives some tips on when it's the right time to look at UHDI as a manufacturing solution.
So, what's in the future for UHDI? John Johnson imagines how UHDI technologies will change PCBs, fabrication, and the tools available to OEM designers.
Possibly the most life-critical application sector is medical devices. John Johnson explains how UHDI can not only improve reliability, but deliver multiple new sets of functionality to the medical instrumentation field.
Inspection systems continue to find themselves at the center of the EMS manufacturing equipment evolution. Joel Scutchfield shines a three-dimensional light on what's driving the market, and a spotlight on Koh Young's latest companion guide to Brent Fischthal's book, "The Printed Circuit Assembler's Guide to SMT Inspection."
High reliability and sustainability are of increasing importance in the products we design and manufacture. How does Ultra High Definition Interconnect deliver on these key design constraints?
In this episode of Voices of the Industry, Marcy LaRont sits down with Satoshi Konagai of Elephantech to spotlight the cutting-edge technology behind their early success. Konagai shares how the company’s unique additive manufacturing process is redefining PCB production—dramatically reducing material waste, lowering energy use, and minimizing environmental impact. And beyond sustainability, Elephantech’s process delivers high-quality, high-performance results for advanced manufacturing. They are looking to transform the global electronics manufacturing landscape and set a new standard for innovation and environmental responsibility.
Materials are the surface upon which all the interconnects are placed. If the material specification cannot accommodate UHDI, the boards will not be successful. John Johnson explains the implications of material choices for UHDI.
Adhesives and coatings are responding to changing industry requirements in innovative ways. Doug Katze delivers a master class on adhesive technologies, their individual appeal in electronics manufacturing, and the market needs driving all this innovation.
Solder mask: So easy to just gloss over this step but when UHDI is involved, you'd best not. John Johnson explains the crucial adjustments to be made even with solder mask in order to open up UHDI's full potential.
Circuit test, inspection, and failure analysis are enjoying a rapid increase in capabilities and sophistication. Test companies, such as Datest, are capable of testing methods we could only dream of ten years ago. Learn how Datest uses their expertise to not only perform high-quality failure analysis, but also to become a valuable DFT resource for the design team.
Continuing our discussion with ASC's John Johnson, we explore the pluses and minuses of copper plating microvias from the perspective of the fabricator and the designer.
Nolan Johnson and ASC's John Johnson explore the implications of UHDI on via from a designer's perspective. The metallurgy, chemistry, mechanics, and stackup reduction mean that designers have fewer constraints with UHDI.
Solder joint reliability is essential to product performance and longevity in electronics. Failures can lead to costly repairs, dissatisfied customers, or even catastrophic loss, depending on the application. In this Voices of the Industry episode, Marcy LaRont talks with Shantanu Joshi of KOKI America about how advanced materials—such as crack-free fluxes and zero-flux-residue solder pastes—are helping address challenges like voiding, heat dissipation, and reliability in demanding environments.
John Johnson continues this series, outlining UHDI's contributions to reduced SWaP—size, weight and power—considerations.
In a thoughtful conclusion to the series, Kuldip Johal connects the key themes, examining market drivers, the technological implications of semiconductor advances, and strategies for aligning PCB production with evolving market demands.
American Standard Circuits' John Johnson details how the new capabilities in UHDI can fundamentally change what it means to design for manufacturability.
Because solder formulations have been enjoying rapid development in the low-temperature solder arena, co-author Pritha Choudhury, senior R&D scientist with MacDermid Alpha, joins Nolan Johnson to discuss the update to The Printed Circuit Assembler's Guide to Low- temperature Soldering. Topics covered include details on key performance traits in low-temperature solder, and Choudhury shares her recommended low-temperature soldering solution.
John Johnson leads the way straight into UHDI's benefits to RF style design.
To launch this series, ASC's John Johnson introduces us to ultra-high-density interconnect. Johnson sets the agenda for further discussion by sharing practical reasons why UHDI could be key to your next design challenge, and why both designers and the manufacturing chain are excited by UHDI's potential.